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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
6 Bit D Latch
The MC10E/100E150 contains six D-type latches with differential outputs. When both Latch Enables (LEN1, LEN2) are LOW, the latch is transparent and input data transitions propagate through to the output. A logic HIGH on either LEN1 or LEN2 (or both) latches the data. The Master Reset (MR) overrides all other controls to set the Q outputs low.
MC10E150 MC100E150
* 800ps Max. Propagation Delay * Extended 100E VEE Range of - 4.2V to - 5.46V * 75k Input Pulldown Resistors
LOGIC DIAGRAM
D0 D R Q0 Q0
6-BIT D LATCH
D1
D R
Q1 Q1 FN SUFFIX PLASTIC PACKAGE CASE 776-02
D2
D R
Q2 Q2
D3
D R
Q3 Q3
D4
D R
Q4 Q4
Pinout: 28-Lead PLCC (Top View)
MR 25 LEN2 LEN1 24 23 NC 22 VCCO 21 Q5 20 Q5 19 18 17 16 15 14 13 12 5 NC 6 VCCO 7 Q0 8 Q0 9 Q1 10 Q1 11 VCCO Q4 Q4 VCC Q3 Q3 Q2 Q2
D5
D R
Q5 Q5
D5 D4 D3 VEE D2 D1
26 27 28 1 2 3 4
LEN1 LEN2 MR
PIN NAMES
Pin D0 - D5 LEN1, LEN2 MR Q0 - Q5 Q0 - Q5
12/93
Function Data Inputs Latch Enables Master Reset True Outputs Inverting Outputs
D0
* All VCC and VCCO pins are tied together on the die.
(c) Motorola, Inc. 1996
2-1
REV 2
MC10E150 MC100E150
DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0C Symbol IIH Characteristic Input HIGH Current D LEN, MR Power Supply Current 10E 100E 52 52 min typ max 200 150 62 62 52 52 min 25C typ max 200 150 62 62 52 60 min 85C typ max 200 150 mA 62 72 Unit A Condition
IEE
AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0C Symbol tPLH tPHL Characteristic Propagation Delay to Output D LEN MR Setup Time D Hold Time D Reset Recovery Time Minimum Pulse Width MR Within-Device Skew Rise/Fall Times 20 - 80% 300 min 250 375 450 200 200 750 400 50 450 650 300 typ 375 500 625 50 - 50 650 max 550 700 750 min 250 375 450 200 200 750 400 50 450 650 300 25C typ 375 500 625 50 - 50 650 max 550 700 750 min 250 375 450 200 200 750 400 50 450 650 ps ps 1 85C typ 375 500 625 50 ps - 50 650 ps ps ps max 550 700 750 ps Unit ps Condition
ts th tRR tPW tSKEW tr tf
1. Within-device skew is defined as identical transitions on similar paths through a device.
MOTOROLA
2-2
ECLinPS and ECLinPS Lite DL140 -- Rev 4
MC10E150 MC100E150
OUTLINE DIMENSIONS
FN SUFFIX PLASTIC PLCC PACKAGE CASE 776-02 ISSUE D
0.007 (0.180) U T L -M
M
B -NY BRK
M
S
N
S S
0.007 (0.180)
T L -M
N
S
D Z -L-M-
W
28 1
D X VIEW D-D G1 0.010 (0.250)
S
V
T L -M
S
N
S
A Z R
0.007 (0.180) 0.007 (0.180)
M
T L -M T L -M
S
N N
S
H
S
0.007 (0.180)
M
T L -M
S
N
S
M
S
C
E G G1 0.010 (0.250)
S
K1 0.004 (0.100) J -TSEATING PLANE
K F VIEW S 0.007 (0.180)
M
VIEW S T L -M
S
T L -M
S
N
S
N
S
NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM A B C E F G H J K R U V W X Y Z G1 K1
INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 -- 0.025 -- 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 -- 0.020 2 10 0.410 0.430 0.040 --
MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 -- 0.64 -- 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 -- 0.50 2 10 10.42 10.92 1.02 --
ECLinPS and ECLinPS Lite DL140 -- Rev 4
2-3
MOTOROLA
MC10E150 MC100E150
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1-800-441-2447 or 602-303-5454 MFAX: RMFAX0@email.sps.mot.com - TOUCHTONE 602-244-6609 INTERNET: http://Design-NET.com
JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-81-3521-8315 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298
MOTOROLA 2-4
*MC10E150/D*
MC10E150/D ECLinPS and ECLinPS Lite DL140 -- Rev 4

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